Method for the calibration of a wire bonder
US6648205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | May 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P1 of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value URef as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth. The Wire Bonder, for example after changing the capillary, is then recalibrated in that a correction factor &ggr; is analogously determined so that the amplitude of the sensor signal assumes the value URef when the ultrasonic transducer is operated with the value P2=&ggr;*P1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.