Method and apparatus for mounting semiconductor chips
US6648215B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached the height H, the fixing of the pick-up tool is released so that the pick-up tool moves downwards from the upper limit position and presses the semiconductor chip onto the adhesive. After a predetermined time after releasing the fixing of the pick-up tool, the bondhead is raised and moved away.With a bondhead particularly suited for the method, the pick-up tool and the bondhead are connected by means of a chamber to which compressed air and/or vacuum can be applied so that, to a large extent, the movement of the pick-up tool can be controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.