Process for manipulating components, a microtool for implementing the process, and a process for manufacturing the microtool or microtool parts

US6648389B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Wilhelm Frey · Palo Alto, US
• Karsten Funk · Stuttgart, DE

Key dates

• Filing date: Apr 17, 2000
• Grant date: Nov 18, 2003
• Expiry date: Apr 17, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S294/902
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A microtool for manipulating components is proposed. A component is held with the microtool by at least one gripper arm having a gripping surface, the gripper being movable by an actuator structure. Also provided is a device for releasing the held component from the gripping surface, whereby an acceleration is induced in the gripper arm for at least a time, and the force of inertia resulting from the inertial mass of the held component and the exerted acceleration will be greater than any force of adhesion acting between the held component and the gripping surface. A process is also proposed for producing a microtool or a microtool part, in particular a microgripper by micropatterning. For this purpose, the microtool or the microtool part to be manufactured is patterned out of a layered structure having a base layer, an intermediate layer, and a structuring layer, which is patterned using a masking layer in conformance with the geometry of the microtool to be manufactured; the microtool or the microtool part is patterned out of the structuring layer. Subsequently, the intermediate layer is then undercut (e.g., etched from underneath) in a second etching process.