Chemical mechanical polishing pad
US6648743B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 5, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jan 16, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for use in chemical mechanical polishing of a semiconductor substrate is described. The polishing pad comprises a substantially flat disk having a polishing surface for contacting the substrate. The polishing surface, which has a central region and a peripheral region, is segmented by a set of substantially parallel linear grooves. The grooves include central grooves which traverse the central region of the polishing surface, and peripheral grooves which traverse the peripheral region of the polishing surface. The central grooves have central groove dimensions, including a central groove width and pitch. The peripheral grooves have peripheral groove dimensions, including a peripheral groove width and pitch. At least one of the central groove dimensions, i.e. the width or the pitch, is different from the corresponding peripheral groove dimension. This difference in groove dimensions from the center to the edge of the polishing surface introduces a difference in the polishing surface area provided near the peripheral region as compared to the central region of the pad. As the polishing pad spins in relation to the substrate being processed, the variation in polishing …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.