Method of manufacturing a semiconductor device having flexible wiring substrate
US6649448B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Sep 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided. Then, a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate. Thereafter the film substrate is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.