Method for determining the relevant ion and particle flows in i-PVD processes

US6649521B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Alfred Kersch · Putzbrunn, DE
• Alexander Ruf · Dresden, DE

Key dates

• Filing date: Jul 29, 2002
• Grant date: Nov 18, 2003
• Expiry date: Jul 29, 2022

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/542
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method for determining relevant deposition parameters in i-PVD processes, includes, first calculating the reaction rates for desired reagents of the gas plasma and of a metal and/or metal compound to be deposited, then simulating the edge coverage of a predetermined structure with the deposited metal based upon the calculated reaction rates with systematic variation of the relevant deposition parameters, and compiling variant tables therefrom. By comparing an experimental verification of the simulated edge coverage by imaging the edge coverage of the metal layer deposited over the determined structure, e.g., using a TEM cross-section, with the simulated deposition parameters for the edge coverages that have been recorded in the variant table, it is possible to read the deposition parameters that are of relevance to the process from the variant table.