Micromechanical diaphragm
US6649989B2 · kind B2 · utility
4Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Oct 3, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0127
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical diaphragm is described which has a partially n-doped p-substrate on its surface and a top n-epitaxial layer, one or more n-epitaxial layers which are p-doped in the diaphragm area being arranged on the p-substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.