Patent · US Expired

Micromechanical diaphragm

US6649989B2 · kind B2 · utility

4Cited by
7References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 3, 2001
Grant dateNov 18, 2003
Priority date
Expiry dateOct 3, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2203/0127
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical diaphragm is described which has a partially n-doped p-substrate on its surface and a top n-epitaxial layer, one or more n-epitaxial layers which are p-doped in the diaphragm area being arranged on the p-substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.