Micro BGA package
US6650005B2 · kind B2 · utility
3Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | May 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.