Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system
US6650022B1 · kind B1 · utility
16Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Sep 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/161
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.