Janice Danvir
9Patents
6h-index
13Co-inventors
52Inventor score
Filing activity: Sep 11, 2002 → Oct 29, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6774497B1 | Flip-chip assembly with thin underfill and thick solder mask | Electricity | 129 | Expired |
| US6821878B2 | Area-array device assembly with pre-applied underfill layers on printed wiring board | Emerging Cross-Sectional Technologies | 70 | Expired |
| US6649445B1 | Wafer coating and singulation method | Electricity | 69 | Expired |
| US7199724B2 | Method and apparatus to aide in emergency egress | Physics | 24 | Expired |
| US6650022B1 | Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system | Electricity | 16 | Expired |
| US7924158B2 | Dynamic updating of product profiles for active lifestyles | Physics | 7 | Active |
| US7834762B2 | Monitoring for radio frequency enabled items based on activity profiles | Physics | 6 | Active |
| US7265994B2 | Underfill film for printed wiring assemblies | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6837293B1 | Heated nozzle assembly | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.