Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
US6650408B2 · kind B2 · utility
7Cited by
8References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 20, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Feb 10, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting a polishing pad, an apparatus for performing the method, and a polishing device adopting the apparatus for preventing wafer defects. Polishing pad defects are detected by comparing optical data from a normal polishing pad, which does not cause wafer defects, with optical data from a polishing pad to be inspected. The respective optical data are obtained by radiating a beam into the polishing pad and then collecting and analyzing a beam reflected from the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.