Yu-Sin Yang
66Patents
5h-index
90Co-inventors
71Inventor score
Filing activity: Oct 16, 2001 → Feb 27, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6803241B2 | Method of monitoring contact hole of integrated circuit using corona charges | Electricity | 11 | Expired |
| US7186280B2 | Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method | Physics | 10 | Expired |
| US6650408B2 | Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus | Physics | 7 | Expired |
| US8034640B2 | Apparatus and method to inspect defect of semiconductor device | Electricity | 5 | Active |
| US6911662B2 | Chemical-mechanical polishing apparatus and method for controlling the same | Physics | 5 | Expired |
| US8126258B2 | Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same | Physics | 5 | Active |
| US8841824B2 | Broadband light illuminators | Electricity | 4 | Active |
| US9036895B2 | Method of inspecting wafer | Physics | 4 | Active |
| US7428328B2 | Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the same | Physics | 4 | Active |
| US9934939B2 | Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereof | Electricity | 4 | Active |
| US8034641B2 | Method for inspection of defects on a substrate | Electricity | 3 | Active |
| US7426031B2 | Method and apparatus for inspecting target defects on a wafer | Physics | 3 | Active |
| US7486392B2 | Method of inspecting for defects and apparatus for performing the method | Physics | 3 | Active |
| US7385689B2 | Method and apparatus for inspecting substrate pattern | Physics | 3 | Active |
| US8050488B2 | Method of analyzing a wafer sample | Physics | 3 | Active |
| US11037283B2 | Inspecting apparatus based on hyperspectral imaging | Electricity | 2 | Active |
| US9659743B2 | Image creating method and imaging system for performing the same | Electricity | 2 | Active |
| US7804591B2 | Wafer inspecting method | Physics | 2 | Active |
| US10001444B2 | Surface inspecting method | Physics | 2 | Active |
| US7446865B2 | Method of classifying defects | Physics | 2 | Active |
| US7394279B2 | Method of measuring a surface voltage of an insulating layer | Physics | 2 | Active |
| US7697130B2 | Apparatus and method for inspecting a surface of a wafer | Physics | 2 | Active |
| US9733178B2 | Spectral ellipsometry measurement and data analysis device and related systems and methods | Physics | 2 | Active |
| US6869215B2 | Method and apparatus for detecting contaminants in ion-implanted wafer | Physics | 1 | Expired |
| US8055056B2 | Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the same | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.