Integrated process tool monitoring system for semiconductor fabrication

US6650958B1 · kind B1 · utility

Assignee

• LSI Logic Corporation · US

Inventors

• Attila Balázs · Kistarcsa, HU
• Bruce Whitefield · Camas, US
• Hiroshi Mizuno · Osaka, JP
• Russell Whaley · Gresham, US
• Paul Szasz · Heidelberg, DE
• Steven Reder · Boring, US

Key dates

• Filing date: Oct 30, 2002
• Grant date: Nov 18, 2003
• Expiry date: Oct 30, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/02
• WIPO field: Control
• WIPO sector: Instruments

Abstract

An integrated process tool monitoring system for semiconductor fabrication. Specifically, a process tool parameter auditing system, where a process tool user need not run a different verification system for each process tool type used and need not download parameters every time before a semiconductor device or material is to be processed by the process tool.