Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
US6651324B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of manufacturing printed circuit boards which is useful in the formation of printed circuit boards containing both areas of thick conductive traces and areas of fine resolution conductors in a single conductive layer, and printed circuit boards formed from such a process. A conductive core is first fabricated containing areas of thick conductors on a relatively thin conductive base. The conductive core is then bonded to a sublayer such as “prepreg” with the thick conductive areas adjacent to the sublayer in order to form a relatively flat laminate. Proper bonding typically requires the use of high resin “prepreg” sublayer. In the alternative, an additional inner layer of pure resin cab be inserted between the conductive core and the insulating sublayer prior to bonding. After bonding, the conductive surface of the laminate is formed into printed conductor traces by methods known in the art. For example, chemical etching may be used to remove conductive material not comprising the printed circuits. In various embodiments of the invention a solder mask coating is applied to the completed printed circuit board. By use of this process, a single layer p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.