Precision bond head for mounting semiconductor chips
US6651866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.