Method of removing silicone polymer deposits from electronic components
US6652665B1 · kind B1 · utility
21Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/288
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.