Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
US6653030B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Feb 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6715
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and system for fabricating micron and sub-micron-sized features within a polymer layer of a nascent semiconductor device or other micro-device or nano-device. Small features are directly imprinted with an optical-mechanical stamp having corresponding intrusions. Large features are created by exposing the surface of selected areas of the polymer surface to UV radiation by transmitting UV radiation through the optical-mechanical stamp to chemically alter the polymer, allowing either UV-exposed or UV-shielded areas to be removed by solvents. Thus, described embodiments of the present invention provide for a partially transparent imprinting mask that employs purely mechanical stamping for fine features and lithography-like chemical polymer removal for large features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.