Composite member separating method, thin film manufacturing method, and composite member separating apparatus
US6653205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a composite member separating method in which a first member (1) having a separation layer (4) and a transfer layer (5) on the separation layer (4) is bonded to a second member (2) is separated at a position different from the bonding interface between the first member (1) and the second member (2), the method comprising the steps of, applying a force asymmetric with respect to the interface to the end portion of the composite member to form a crack (7A) that runs from the surface of the first member (1) to the separation layer (4) through the transfer layer (5), and then, growing the crack is grown along the separation layer (4) to completely separate the composite member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.