Thermal isolation using vertical structures
US6653239B2 · kind B2 · utility
1Cited by
22References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 30, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0118
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.