Alternate bump metallurgy bars for power and ground routing
US6653563B2 · kind B2 · utility
98Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of electrically conductive bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.