Semiconductor device and method for fabricating same
US6653731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A top surface of a LSI chip having a structure of a bare chip is provided with bumps, and a protective resin is provided for at least side surfaces of the LSI chips. The LSI chip is prevented from being chipped off or cracked because of protective resin provided for the side surfaces of the LSI chip. The invention provides a semiconductor device and a method for fabricating the same, in which the chip or a package thereof is prevented from being damaged, and thereby yield rate of the semiconductor device can be heightened. Since the numbers of the parts of the semiconductor device and the steps of using jigs and tools necessary for the fabrication process are reduced, fabricating cost of the semiconductor device can be cut down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.