Masamoto Tago
29Patents
12h-index
17Co-inventors
74Inventor score
Filing activity: Nov 14, 1994 → Sep 21, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5508561A | Apparatus for forming a double-bump structure used for flip-chip mounting | Electricity | 221 | Expired |
| US5633204A | Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip | Electricity | 141 | Expired |
| US6844619B2 | Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same | Electricity | 140 | Expired |
| US7135770B2 | Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection | Emerging Cross-Sectional Technologies | 42 | Expired |
| US7268438B2 | Semiconductor element including a wet prevention film | Emerging Cross-Sectional Technologies | 25 | Expired |
| US7449406B2 | Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same | Emerging Cross-Sectional Technologies | 24 | Active |
| US6653731B2 | Semiconductor device and method for fabricating same | Electricity | 23 | Expired |
| US7218005B2 | Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same | Electricity | 20 | Expired |
| US6969915B2 | Semiconductor device, manufacturing method and apparatus for the same | Electricity | 16 | Expired |
| US6583514B2 | Semiconductor device with a binary alloy bonding layer | Electricity | 15 | Expired |
| US7611041B2 | Semiconductor device, manufacturing method and apparatus for the same | Electricity | 13 | Active |
| US6344696B2 | Chip size package semiconductor device and method of forming the same | Electricity | 12 | Expired |
| US7749888B2 | Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same | Emerging Cross-Sectional Technologies | 11 | Active |
| US7793818B2 | Semiconductor device, manufacturing method and apparatus for the same | Electricity | 11 | Active |
| US7282432B2 | Semiconductor device, manufacturing method and apparatus for the same | Electricity | 10 | Expired |
| US8513810B2 | Semiconductor device and method of manufacturing same | Electricity | 6 | Active |
| US7728439B2 | Semiconductor device, wiring substrate, and method for manufacturing wiring substrate | Electricity | 5 | Expired |
| US6555416B2 | Chip size package semiconductor device and method of forming the same | Electricity | 3 | Expired |
| US6882542B2 | Electronic apparatus | Electricity | 2 | Expired |
| US6803253B2 | Method for laminating and mounting semiconductor chip | Electricity | 2 | Expired |
| US7098538B1 | System semiconductor device and method of manufacturing the same | Electricity | 2 | Expired |
| US7297575B2 | System semiconductor device and method of manufacturing the same | Electricity | 2 | Expired |
| US7525189B2 | Semiconductor device, wiring board, and manufacturing method thereof | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7692287B2 | Semiconductor device and wiring board | Electricity | 1 | Active |
| US8791544B2 | Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.