Patent · US Expired

Electronic component having a semiconductor chip

US6653732B2 · kind B2 · utility

1Cited by

6References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Alpern · Hersbruck, DE
Thomas Rainer Herzog · Höhenkirchen-Siegertsbrunn, DE
Wolfgang Sauert · Hersbruck, DE
Heinz Schauer · Erding, DE
Rainer Tilgner · Birkenfeld, DE

Key dates

Filing date	May 7, 2001
Grant date	Nov 25, 2003
Priority date	—
Expiry date	May 24, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.