System for detecting surface defects in semiconductor wafers
US6654109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Feb 5, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8825
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Defects such as holes and bumps in the surface of a semiconductor wafer are detected by an optical inspection system that combines darkfield and brightfield illumination techniques. A single light stop, which forms part of the illumination system, includes a pair of openings configured to produce both a solid cone of light and a hollow of light which are simultaneously focused onto the wafer surface. The directly emanating light as well as the scattered light collected from the wafer surface produce a resultant image that is the product of darkfield and brightfield illumination. Modulation of the light beam and tilting of the light focused onto the wafer surface may be advantageously used to improved contrast and resolution of the viewed image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.