Implementing micro BGA assembly techniques for small die
US6655022B1 · kind B1 · utility
6Cited by
17References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1998 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.