Optoelectronic package with dam structure to provide fiber standoff
US6655854B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | May 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48471
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic component is described that includes a photonic device carried by a base substrate. A dam structure is formed on the base substrate by dispensing and hardening a precise amount of a flowable material. The dam structure is sized to define a desired standoff between an optical fiber and an active facet on the photonic device. In embodiments where the photonic device is wire bonded to the base substrate, it may be desirable to provide a reverse wire bond in order to permit the optical fiber to be placed closer to the photonic device. In some embodiments, the base substrate takes the form of a flexible material having electrically conductive traces thereon that are electrically connected to the photonic device. An optical component support block may be provided to support the flex material. In some implementations, a semiconductor die may be directly soldered to the traces on the flexible material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.