Silica-based slurry
US6656241B1 · kind B1 · utility
28Cited by
35References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Jun 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization (“CMP”) of semiconductor and other microelectronic substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.