Jason Keleher
9Patents
7h-index
18Co-inventors
56Inventor score
Filing activity: Dec 27, 1999 → Jan 11, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6258721A | Diamond slurry for chemical-mechanical planarization of semiconductor wafers | Electricity | 54 | Expired |
| US8435421B2 | Metal-passivating CMP compositions and methods | Electricity | 34 | Active |
| US6656241B1 | Silica-based slurry | Electricity | 28 | Expired |
| US6242351A | Diamond slurry for chemical-mechanical planarization of semiconductor wafers | Electricity | 19 | Expired |
| US7456107B2 | Compositions and methods for CMP of low-k-dielectric materials | Electricity | 12 | Active |
| US6660639B2 | Method of fabricating a copper damascene structure | Chemistry; Metallurgy | 10 | Expired |
| US6508953B1 | Slurry for chemical-mechanical polishing copper damascene structures | Chemistry; Metallurgy | 9 | Expired |
| US7955520B2 | Copper-passivating CMP compositions and methods | Chemistry; Metallurgy | 5 | Active |
| US6916428B2 | Photo-chemical remediation of Cu-CMP waste | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.