Solder paste and soldering method of the same
US6656291B1 · kind B1 · utility
7Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder paste including a solder powder; and a flux including at least an activating agent, and acid anhydride obtained by a dehydration reaction of aliphatic carboxylic acid having up to seven carbon atoms. The solder paste provides excellent solderability, high corrosive resistance and a good shelf life, but not an offensive smell, during the soldering operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.