Hidefumi Ueda
9Patents
6h-index
14Co-inventors
56Inventor score
Filing activity: Jul 22, 1986 → Jun 12, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5643831A | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Electricity | 200 | Expired |
| US6025258A | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Electricity | 52 | Expired |
| US6353545B1 | Inverter apparatus with active current limiting and smoothing circuit | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5531185A | Manufacturing apparatus for use in a micro-gravity environment | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6528346B2 | Bump-forming method using two plates and electronic device | Electricity | 12 | Expired |
| US6656291B1 | Solder paste and soldering method of the same | Performing Operations; Transporting | 7 | Expired |
| US4725014A | Automatic locking retractor for a seat belt assembly | Performing Operations; Transporting | 2 | Expired |
| US6157181A | Step-down DC/DC converter for converting a high DC input voltage into a low DC output voltage | Electricity | 2 | Expired |
| US6147524A | Inverter device driving method | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.