Patent · US Expired

Process of fabricating a precision microcontact printing stamp

US6656308B2 · kind B2 · utility

56Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 22, 2002
Grant dateDec 2, 2003
Priority date
Expiry dateMay 29, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/11
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A process of making a microcontact printing stamp useful in microcontact printing of microcircuits. In this process an elastomeric microcontact printing stamp is formed by curing an elastomeric monomer or oligomer in a mold in which a photoresist master, defining a microcircuit in negative relief, is predisposed above a flat and rigid backplane laminate. The flat and rigid plane member of the backplane laminate is delaminated from the backplane after the printing stamp is removed from the mold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.