Process of fabricating a precision microcontact printing stamp
US6656308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2002 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | May 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/11
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process of making a microcontact printing stamp useful in microcontact printing of microcircuits. In this process an elastomeric microcontact printing stamp is formed by curing an elastomeric monomer or oligomer in a mold in which a photoresist master, defining a microcircuit in negative relief, is predisposed above a flat and rigid backplane laminate. The flat and rigid plane member of the backplane laminate is delaminated from the backplane after the printing stamp is removed from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.