Patent · US Expired

Nonstick layer for a micromechanical component

US6656368B2 · kind B2 · utility

2Cited by
8References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 2, 2000
Grant dateDec 2, 2003
Priority date
Expiry dateMar 2, 2020

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/112
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.