Nonstick layer for a micromechanical component
US6656368B2 · kind B2 · utility
2Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Mar 2, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/112
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.