Thermal enhancement approach using solder compositions in the liquid state
US6656770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Sep 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips.The electronic module cover is a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate in order to provide, in conjunction with the solder composition, a path of high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.