Reworkable thermosetting resin compositions

US6657031B1 · kind B1 · utility

Assignee

• Loctite Corporation · US

Inventors

• Lawrence N. Crane · Tustin, US
• Christopher K. Ober · Ithaca, US
• Young Cheol Bae · Weston, US
• Shuyan Yu · Beijing, CN
• Jong-Wook Park · Suwon-si, KR

Key dates

• Filing date: Jul 31, 2001
• Grant date: Dec 2, 2003
• Expiry date: Jul 31, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19042
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.