Multiple redundant through hole electrical interconnects and method for forming the same
US6659592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jan 1, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.