Barry C. Snyder
6Patents
3h-index
9Co-inventors
42Inventor score
Filing activity: Aug 16, 2001 → Jun 21, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6716737B2 | Method of forming a through-substrate interconnect | Electricity | 81 | Expired |
| US6902872B2 | Method of forming a through-substrate interconnect | Electricity | 5 | Expired |
| US7432582B2 | Method of forming a through-substrate interconnect | Electricity | 3 | Expired |
| US8174094B2 | Bonded structures formed by plasma enhanced bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US7563691B2 | Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6659592B2 | Multiple redundant through hole electrical interconnects and method for forming the same | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.