Patent · US Expired

Seed layer repair bath

US6660153B2 · kind B2 · utility

10Cited by
4References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 17, 2001
Grant dateDec 9, 2003
Priority date—
Expiry dateFeb 9, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/244
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.