Seed layer
US6660154B2 · kind B2 · utility
5Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.