Optoelectronic packaging assembly
US6663294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2001 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Oct 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02251
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.