Patent · US Expired

Method for producing three-dimensional structures by means of an etching process

US6663784B1 · kind B1 · utility

3Cited by
1References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 4, 2002
Grant dateDec 16, 2003
Priority date
Expiry dateFeb 4, 2022

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C1/00412
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method is proposed for producing three-dimensional structures, especially microlenses, in a substrate using an etching process, at least one original shape having a known original surface shape being present initially on the substrate in a plurality of places. The etching process has at least one first etching removal rate a1 and a second etching removal rate a2 which are material-dependent, and of which at least one is changeable as a function of time. The original shape is converted to a target shape by the etching process, the original surface shape of the original shape and the target surface shape of the target shape to be reached being known before the beginning of the etching process. In order to achieve the target surface shape, at least one of the etching rates a2 or a1 is set by a change of at least one etching parameter calculated before the beginning of the etching process as a function of the etching time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.