Lead frame and method of manufacturing the same
US6664133B2 · kind B2 · utility
6Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.