Method of manufacturing a semiconductor component and polyimide etchant therefor
US6664200B1 · kind B1 · utility
0Cited by
1References
30Claims
0Family size
Inventors
Key dates
| Filing date | Apr 28, 2000 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Apr 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor component having a layer (240, 340) comprised of polyimide includes using an etchant that is at least partially composed of aminopropanediol to etch the layer comprised of polyimide. The etchant can also include a solvent, a diluent, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.