Lead frame and bottom lead semiconductor package using the lead frame
US6664614B2 · kind B2 · utility
4Cited by
9References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between the dam bar; a tie bar for supporting the die paddle; a plurality of leads each consisting of a first lead having a predetermined length extended from the dam bar between the dam bar and the die paddle, a second lead connected electrically to the first lead and formed bent in a first direction, and a third lead connected electrically to the second lead and formed bent in a second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.