Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment
US6666369B2 · kind B2 · utility
20Cited by
24References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Jan 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to heat the solder bumps. Accordingly, the solder bumps can be formed without the use of flux not to generate voids in the solder layer, and also the cleaning required after the solder bumps are formed can be omitted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.