Conductive adhesive and packaging structure using the same
US6666994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2002 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Dec 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.