Coupon registration mechanism and method
US6667090B2 · kind B2 · utility
2Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A registration coupon is provided for a printed circuit board or other substrate. The registration coupon may be used to determine a hole-to-outer layer feature registration and a solder mask registration. The registration coupon may include a registration hole provided on the circuit board, a metal pad and an anti-pad provided on the circuit board about the registration hole, and a solder mask covering the metal pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.