Thermosetting resin composition and use thereof
US6667107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2002 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Jan 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number,and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.