Semiconductor configuration with ohmic contact-connection and method for contact-connecting a semiconductor configuration
US6667495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2000 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | May 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor configuration with ohmic contact-connection includes a first and a second semiconductor region made of silicon carbide, each having a different conduction type. A first and a second contact region serve for contact-connection. The first contact region and the second contact region have an at least approximately identical material composition which is practically homogeneous within the respective contact region. A method is provided for contact-connecting n-conducting and p-conducting silicon carbide, in each case with at least approximately identical material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.