Emulator chip package that plugs directly into the target system
US6668242B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1998 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Sep 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to electronic packaging and a method for manufacturing the same. According to an embodiment of the present invention, an emulator chip package is designed and assembled such that a bottom portion of the emulator chip package is approximately the same electronic package used to package the target chip. Additionally, a top portion of the emulator chip package is approximately a slightly modified version of the same type of package used to package the target chip. According to an embodiment of the present invention, the top portion of the emulator chip package is attached to the bottom portion of the emulator chip package. The lead connector pins of the top portion of the package preferably leads up, while the connector pins of the bottom portion of the package preferably leads down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.