Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
US6670101B2 · kind B2 · utility
5Cited by
23References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2002 |
| Grant date | Dec 30, 2003 |
| Priority date | — |
| Expiry date | Mar 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.